MRI
MRI India Journals Vol. 14 No. 1 (2025)

AI and Augmented Reality for Herbal Knowledge Preservation: A Smart Approach to Medicinal Plant Identification and Education

Authors

  • Kunal Panche UG Student, Department of Computer Engineering, SCET, Nagpur, Maharashtra, India kunalpanche34@gmail.com
  • Siddharth Parihar UG Student, Department of Computer Engineering, SCET, Nagpur, Maharashtra, India
  • Hitesh Mankar UG Student, Department of Computer Engineering, SCET, Nagpur, Maharashtra, India
  • Khushi Rokade  UG Student, Department of Computer Engineering, SCET, Nagpur, Maharashtra, India
  • Kalpana Malpe HOD, Department of Computer Engineering, SCET, Nagpur, Maharashtra, India

DOI:

https://doi.org/10.65521/ijaece.v14i1.417

Keywords:

Artificial Intelligence (AI) Augmented Reality (AR) Herbal Knowledge Preservation

Abstract

Traditional herbal knowledge is fading due to limited awareness, difficulties in plant identification, and a lack of accessible learning resources. ARVeda bridges this gap by integrating Artificial intelligence (AI) and Augmented Reality to create an interactive and immersive herbal education platform. The system features AI-powered plant recognition, AR-based 3D herb visualization, and a multilingual AI assistant, enabling real-time identifiacation, medicinal insights, and personalized learning. Users can ask questions, receive contextual explanations, and explore plants in 3D, enhancing engagement and retention. Gamification elements, such as Plant Knowledge Cards, achievement badges, and a Global Leaderboard, encourage exploration and learning. ARVeda offers a scalable and inclusive solution, preserving traditional medicine through digital innovation, benefiting students, researchers, practitioners, and herbal enthusiasts worldwide.

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Published

2025-05-23

How to Cite

Panche, K., Parihar, S., Mankar, H., Rokade, K., & Malpe, K. (2025). AI and Augmented Reality for Herbal Knowledge Preservation: A Smart Approach to Medicinal Plant Identification and Education. International Journal on Advanced Electrical and Computer Engineering, 14(1), 218–223. https://doi.org/10.65521/ijaece.v14i1.417

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